Note:
This project will be discontinued after December 13, 2021. [more]
Product:
Sda660_firmware
(Qualcomm)Repositories |
Unknown: This might be proprietary software. |
#Vulnerabilities | 410 |
Date | Id | Summary | Products | Score | Patch | Annotated |
---|---|---|---|---|---|---|
2018-09-20 | CVE-2018-11287 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency. | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware | 9.8 | ||
2018-09-20 | CVE-2018-11285 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd625_firmware, Sd650_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware | 7.8 | ||
2019-01-18 | CVE-2018-11284 | Spoofed SMS can be used to send a large number of messages to the device which will in turn initiate a flood of registration updates with the server in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 625, SD 636, SDA660, SDM630, SDM660, SDX20 | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_625_firmware, Sd_636_firmware, Sda660_firmware, Sdm630_firmware, Sdm660_firmware, Sdx20_firmware | 9.3 | ||
2019-01-18 | CVE-2018-11279 | Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660,... | Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9625_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_429_firmware, Sd_430_firmware, Sd_435_firmware, Sd_439_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_636_firmware, Sd_650_firmware, Sd_652_firmware, Sd_670_firmware, Sd_710_firmware, Sd_712_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sda660_firmware, Sdm439_firmware, Sdm630_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware, Sxr1130_firmware | 8.8 | ||
2018-09-20 | CVE-2018-11277 | In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to... | Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd430_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware | 7.8 | ||
2018-09-20 | CVE-2018-11269 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware | 7.8 | ||
2018-09-20 | CVE-2018-11268 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware | 7.8 | ||
2018-09-20 | CVE-2018-11267 | In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region... | Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9640_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd600_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware | 7.8 | ||
2018-11-28 | CVE-2018-11264 | Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660. | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sda660_firmware | 7.8 | ||
2019-01-18 | CVE-2017-18332 | Security keys are logged when any WCDMA call is configured or reconfigured in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130 | Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_670_firmware, Sd_710_firmware, Sd_712_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sda660_firmware, Sdx20_firmware, Sxr1130_firmware | 5.5 |