Product:

Sd_845_firmware

(Qualcomm)
Repositories

Unknown:

This might be proprietary software.
#Vulnerabilities 352
Date Id Summary Products Score Patch Annotated
2018-04-11 CVE-2017-18145 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur. Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_415_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18144 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur. Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_415_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18142 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 835, SD 845, SD 850, while processing the IMS SIP username, a buffer overflow can occur. Mdm9650_firmware, Mdm9655_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18140 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free... Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18139 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18138 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. Mdm9206_firmware, Mdm9607_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18136 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18135 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, in the Wireless Data Service (WDS) module, a buffer overflow can occur. Mdm9650_firmware, Mdm9655_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18134 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850, a buffer overflow may potentially occur while processing a response from the SIM card. Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18127 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing a SetParam command packet in the VR service, the extracted name_len and value_len values are not checked and could potentially cause a buffer overflow in subsequent calls to memcpy(). Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_430_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware 9.8