Product:

Sd_845_firmware

(Qualcomm)
Repositories

Unknown:

This might be proprietary software.
#Vulnerabilities 352
Date Id Summary Products Score Patch Annotated
2018-04-11 CVE-2017-18142 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 835, SD 845, SD 850, while processing the IMS SIP username, a buffer overflow can occur. Mdm9650_firmware, Mdm9655_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18140 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free... Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18139 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18138 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. Mdm9206_firmware, Mdm9607_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18136 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18135 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, in the Wireless Data Service (WDS) module, a buffer overflow can occur. Mdm9650_firmware, Mdm9655_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18134 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850, a buffer overflow may potentially occur while processing a response from the SIM card. Sd_845_firmware, Sd_850_firmware 9.8
2018-04-11 CVE-2017-18127 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing a SetParam command packet in the VR service, the extracted name_len and value_len values are not checked and could potentially cause a buffer overflow in subsequent calls to memcpy(). Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_430_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware 9.8
2018-04-11 CVE-2017-18125 In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, when secure camera is activated it stores captured data in protected buffers. The TEE application which uses secure camera expects those buffers to contain data captured during the current camera session. It is possible though for HLOS to put aside and reuse one or more of the protected buffers with previously captured... Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware 7.5
2018-10-26 CVE-2017-18124 During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 Fsm9055_firmware, Ipq4019_firmware, Mdm9206_firmware, Mdm9607_firmware, Mdm9625_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_800_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sda660_firmware, Sdx20_firmware 7.8