Note:
This project will be discontinued after December 13, 2021. [more]
Product:
Sd_625_firmware
(Qualcomm)| Repositories |
Unknown: This might be proprietary software. |
| #Vulnerabilities | 434 |
| Date | Id | Summary | Products | Score | Patch | Annotated |
|---|---|---|---|---|---|---|
| 2018-04-11 | CVE-2017-18145 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur. | Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_415_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18144 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur. | Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_415_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18140 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free... | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18139 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18138 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. | Mdm9206_firmware, Mdm9607_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18137 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9640, MDM9645, MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 835, while processing the IPv6 pdp address of the pdp context, a buffer overflow can occur. | Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_810_firmware, Sd_820_firmware, Sd_835_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18136 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. | Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9650_firmware, Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_400_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_808_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18135 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, in the Wireless Data Service (WDS) module, a buffer overflow can occur. | Mdm9650_firmware, Mdm9655_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware | 9.8 | ||
| 2018-04-11 | CVE-2017-18127 | In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing a SetParam command packet in the VR service, the extracted name_len and value_len values are not checked and could potentially cause a buffer overflow in subsequent calls to memcpy(). | Msm8909w_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_430_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_835_firmware, Sd_845_firmware | 9.8 | ||
| 2018-10-26 | CVE-2017-18124 | During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 | Fsm9055_firmware, Ipq4019_firmware, Mdm9206_firmware, Mdm9607_firmware, Mdm9625_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_800_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sda660_firmware, Sdx20_firmware | 7.8 |