Note:
This project will be discontinued after December 13, 2021. [more]
Product:
Sd_410_firmware
(Qualcomm)| Repositories |
Unknown: This might be proprietary software. |
| #Vulnerabilities | 245 |
| Date | Id | Summary | Products | Score | Patch | Annotated |
|---|---|---|---|---|---|---|
| 2019-02-11 | CVE-2018-11855 | If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660. | Mdm9607_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_636_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_8cx_firmware, Sda660_firmware, Sdm630_firmware, Sdm660_firmware | 7.8 | ||
| 2019-02-11 | CVE-2018-11847 | Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074,... | Ipq8074_firmware, Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Qca8081_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_429_firmware, Sd_430_firmware, Sd_435_firmware, Sd_439_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_632_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_8cx_firmware, Sdm439_firmware, Snapdragon_high_med_2016_firmware | 7.8 | ||
| 2019-02-25 | CVE-2018-11845 | Usage of non-time-constant comparison functions can lead to information leakage through side channel analysis in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in versions MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD... | Mdm9150_firmware, Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Qcs605_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_425_firmware, Sd_427_firmware, Sd_429_firmware, Sd_430_firmware, Sd_435_firmware, Sd_439_firmware, Sd_450_firmware, Sd_625_firmware, Sd_632_firmware, Sd_636_firmware, Sd_650_firmware, Sd_652_firmware, Sd_670_firmware, Sd_675_firmware, Sd_710_firmware, Sd_712_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sd_8cx_firmware, Sda660_firmware, Sdm439_firmware, Sdm630_firmware, Sdm660_firmware, Snapdragon_high_med_2016_firmware, Sxr1130_firmware | 5.5 | ||
| 2019-04-04 | CVE-2018-11830 | Improper input validation in QCPE create function may lead to integer overflow in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 410/12, SD 820A | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Sd_410_firmware, Sd_412_firmware, Sd_820a_firmware | 7.8 | ||
| 2019-02-25 | CVE-2018-11289 | Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD... | Ipq8074_firmware, Mdm9150_firmware, Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Qca8081_firmware, Qcs605_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_425_firmware, Sd_427_firmware, Sd_429_firmware, Sd_430_firmware, Sd_435_firmware, Sd_439_firmware, Sd_450_firmware, Sd_625_firmware, Sd_632_firmware, Sd_636_firmware, Sd_650_firmware, Sd_652_firmware, Sd_670_firmware, Sd_675_firmware, Sd_710_firmware, Sd_712_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sd_8cx_firmware, Sda660_firmware, Sdm439_firmware, Sdm630_firmware, Sdm660_firmware, Snapdragon_high_med_2016_firmware, Sxr1130_firmware | 7.8 | ||
| 2019-01-18 | CVE-2018-11288 | Possible undefined behavior due to lack of size check in function for parameter segment_idx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDX24, SXR1130 | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_670_firmware, Sd_710_firmware, Sd_712_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sdx24_firmware, Sxr1130_firmware | 7.8 | ||
| 2019-01-18 | CVE-2018-11279 | Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660,... | Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9625_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_429_firmware, Sd_430_firmware, Sd_435_firmware, Sd_439_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_636_firmware, Sd_650_firmware, Sd_652_firmware, Sd_670_firmware, Sd_710_firmware, Sd_712_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sda660_firmware, Sdm439_firmware, Sdm630_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware, Sxr1130_firmware | 8.8 | ||
| 2018-11-28 | CVE-2018-11264 | Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660. | Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sda660_firmware | 7.8 | ||
| 2018-07-06 | CVE-2018-11259 | Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. Apps processor then has non-secure world full read/write access to the partition until the modem boots and configures the EFS partition addresses in its MPU partition. | Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_430_firmware, Sd_435_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_800_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware | 7.7 | ||
| 2019-01-03 | CVE-2017-18323 | Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. | Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_670_firmware, Sd_710_firmware, Sd_712_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sda660_firmware, Sdx20_firmware, Sxr1130\._firmware | 5.5 |