Product:

Msm8996au_firmware

(Qualcomm)
Repositories

Unknown:

This might be proprietary software.
#Vulnerabilities 689
Date Id Summary Products Score Patch Annotated
2019-01-18 CVE-2018-11288 Possible undefined behavior due to lack of size check in function for parameter segment_idx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDX24, SXR1130 Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_670_firmware, Sd_710_firmware, Sd_712_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sdx24_firmware, Sxr1130_firmware 7.8
2018-09-20 CVE-2018-11287 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency. Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware 9.8
2018-09-20 CVE-2018-11285 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd625_firmware, Sd650_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware 7.8
2019-01-18 CVE-2018-11279 Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660,... Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9625_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_429_firmware, Sd_430_firmware, Sd_435_firmware, Sd_439_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_625_firmware, Sd_636_firmware, Sd_650_firmware, Sd_652_firmware, Sd_670_firmware, Sd_710_firmware, Sd_712_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sda660_firmware, Sdm439_firmware, Sdm630_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware, Sxr1130_firmware 8.8
2018-09-20 CVE-2018-11277 In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to... Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd415_firmware, Sd430_firmware, Sd450_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sda660_firmware 7.8
2018-09-20 CVE-2018-11269 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware 7.8
2018-09-20 CVE-2018-11268 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9645_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd810_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdm710_firmware, Sdx20_firmware 7.8
2018-09-20 CVE-2018-11267 In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region... Mdm9206_firmware, Mdm9607_firmware, Mdm9615_firmware, Mdm9640_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8996au_firmware, Sd205_firmware, Sd210_firmware, Sd212_firmware, Sd410_firmware, Sd412_firmware, Sd415_firmware, Sd425_firmware, Sd427_firmware, Sd430_firmware, Sd435_firmware, Sd450_firmware, Sd600_firmware, Sd615_firmware, Sd616_firmware, Sd617_firmware, Sd625_firmware, Sd650_firmware, Sd652_firmware, Sd820_firmware, Sd820a_firmware, Sd835_firmware, Sd845_firmware, Sd850_firmware, Sda660_firmware, Sdm429_firmware, Sdm439_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware 7.8
2018-11-28 CVE-2018-11264 Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660. Mdm9206_firmware, Mdm9607_firmware, Mdm9650_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_425_firmware, Sd_430_firmware, Sd_450_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sda660_firmware 7.8
2018-07-06 CVE-2018-11259 Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. Apps processor then has non-secure world full read/write access to the partition until the modem boots and configures the EFS partition addresses in its MPU partition. Mdm9206_firmware, Mdm9607_firmware, Mdm9635m_firmware, Mdm9640_firmware, Mdm9650_firmware, Mdm9655_firmware, Msm8909w_firmware, Msm8996au_firmware, Sd_205_firmware, Sd_210_firmware, Sd_212_firmware, Sd_410_firmware, Sd_412_firmware, Sd_415_firmware, Sd_425_firmware, Sd_427_firmware, Sd_430_firmware, Sd_435_firmware, Sd_450_firmware, Sd_615_firmware, Sd_616_firmware, Sd_617_firmware, Sd_625_firmware, Sd_650_firmware, Sd_652_firmware, Sd_800_firmware, Sd_810_firmware, Sd_820_firmware, Sd_820a_firmware, Sd_835_firmware, Sd_845_firmware, Sd_850_firmware, Sdm630_firmware, Sdm632_firmware, Sdm636_firmware, Sdm660_firmware, Sdx20_firmware, Snapdragon_high_med_2016_firmware 7.7